TECHNOLOGY Platform: Joint Platform on Device fabrication facilities

a) Description:

The highest level in technology resources in Europe for the microwave/photonics domain:

1. Processing facilities:
   -Semiconductor: Si and compound materials
   -Glass
   -LiNbO3
   -Polymers
   -Fibre
2. Application fields
   -Micro- and millimetre-wave components
   -Integrated optics and photonics
   - Optoelectronic components
   -Fibre based components: Bragg gratings,...

Global Facilities

You are looking for informations that shall be more precisely defined in a particular field:

• Semiconductor device fabrication
• Fibre optics components
• LiNbO₃ devices
• Glass integrated optics
• Packaging solutions

Detailed equipment

You are searching access to a specific equipment. Main are reported below. If you do not find what you are looking for, choose the partner whose listed equipment is more closely technically linked (i.e., RTA facilities are usually available where metal deposition facilities are located) or either go to above paragraph (global possibilities of JPB-TD) or contact a platform enginneer.

Device fabrication

• Semiconductor growth facilities
• Mask fabrication and lithography tools
• Metal deposition: evaporation, sputtering, electroplating
• Dry etching: RIE, CAIBE, ICP, Ion milling, FIB
• Dielectrics deposition: PECVD, LPCVD
• Fibre Bragg grating facilities
• Special monomode fibres
• Ion diffusion/exchange (glass waveguides)
• bservation and metrology tools: SEM, AFM, SPM

Integration/packaging

• Chip separation: dicing, scribing, cleaving
• Wire bonding
• Flip-chip bonding
• Microwave substrate fabrication
• Optical pigtailing

b) Contact the TECHNOLOGY Platform central co-ordinating point